Ajitha Krishnan

FAQ About Ajitha Krishnan

• What is Ajitha Krishnan's address?

  Ajitha Krishnan is located at
  Stuttgart, Baden-Württemberg, Germany

• What is Ajitha Krishnan's job title?

  Ajitha Krishnan is a
   Team Lead for PCB and IC Package Design Division in Tessolve Semiconductor Pvt. Ltd.  Total of 11 years of industrial experience. 4.5 years of experience in IC Packaging, 8 years of experience in PCB, 3 years of experience in Signal Integrity and 2 years of experience in Cadence Skill Programming (Using Lisp Language).  Expert in Flip chip, Wire bond, CSP, COB and POP IC Package designs and its Signal/Power Integrity Analysis using Sigirity/XtractIM.  Worked on Stacked dies (Vertical and Horizontal) and Multi-Chip Modules.  Have done several FC and WB designs with High speeds and High voltages. Have done Simulation for cross talk, impedance and power inductance for the packages.  Well expert in PCB Designs from Schematic to Gerber Generation and its Pre/Post Route SI Analysis.  Expert in designing High Complex & High Speed HDI, Digital, Analog, High current/voltage, ATE, Probe card, Mixed signal, RF & Metal Core PC Boards.  Skilled in technologies like DDRx, QDR, PCIe, XAUI, Gigabit Ethernet, SATA, SERDES,PHY etc.  Have done several Skill Coding for Library and Design Automation using Cadence Skill Programming.  Worked at client places for the package and pcb designs. Currently working as contract employee for one of the Leading Company for Package design for past 3 years.  ISO 9001:2015 TUV SUD Certified Internal Auditor Certificate No: TUVSA/AC/CT/2016/0037/O/0001/QM33/1/0016. Apple

• What industry does Ajitha Krishnan currently work in?

  Ajitha Krishnan currently works in the
  Apple

• What is Ajitha Krishnan's area of expertise?

  Ajitha Krishnan specializes in
   Team Lead for PCB and IC Package Design Division in Tessolve Semiconductor Pvt. Ltd.  Total of 11 years of industrial experience. 4.5 years of experience in IC Packaging, 8 years of experience in PCB, 3 years of experience in Signal Integrity and 2 years of experience in Cadence Skill Programming (Using Lisp Language).  Expert in Flip chip, Wire bond, CSP, COB and POP IC Package designs and its Signal/Power Integrity Analysis using Sigirity/XtractIM.  Worked on Stacked dies (Vertical and Horizontal) and Multi-Chip Modules.  Have done several FC and WB designs with High speeds and High voltages. Have done Simulation for cross talk, impedance and power inductance for the packages.  Well expert in PCB Designs from Schematic to Gerber Generation and its Pre/Post Route SI Analysis.  Expert in designing High Complex & High Speed HDI, Digital, Analog, High current/voltage, ATE, Probe card, Mixed signal, RF & Metal Core PC Boards.  Skilled in technologies like DDRx, QDR, PCIe, XAUI, Gigabit Ethernet, SATA, SERDES,PHY etc.  Have done several Skill Coding for Library and Design Automation using Cadence Skill Programming.  Worked at client places for the package and pcb designs. Currently working as contract employee for one of the Leading Company for Package design for past 3 years.  ISO 9001:2015 TUV SUD Certified Internal Auditor Certificate No: TUVSA/AC/CT/2016/0037/O/0001/QM33/1/0016.

• Which languages does Ajitha Krishnan speak? 

  Ajitha Krishnan speaks the following languages:
  No languages available.

• Which industries has Ajitha Krishnan previously worked in?   

  Ajitha Krishnan has prior experience in the following industries:
  Tessolve Semiconductor

• What is Ajitha Krishnan’s work experience?  

  Ajitha Krishnan has the following professional experience:
  Apple , Tessolve Semiconductor .

• How can I find Ajitha Krishnan on LinkedIn?  

  You can view Ajitha Krishnan’s
  LinkedIn profile at LinkedIn URL.

• What are Ajitha Krishnan’s work email addresses?  

  Ajitha Krishnan’s work email addresses are
  [email protected] .

• What company does Ajitha Krishnan work for?  

  Ajitha Krishnan works at
  Apple