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Fan Wu

1) Process development engineer with 5 years’ leadership in wirebond, dispense and EMC molding process focusing on process... | Corvallis, Oregon, United States

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Fan Wu’s Location Corvallis, Oregon, United States

Fan Wu’s Expertise 1) Process development engineer with 5 years’ leadership in wirebond, dispense and EMC molding process focusing on process innovation and quality control 2) 7 years’ professional experience in electronic packaging and IC packaging material development 3) Extensive experience in MEMS packaging, FMEA, SPC, DOE, module integration, high volume manufacturing, risk management and factory automation 4) Highly accomplished in working with external vendors for tool assessment, material qualification, new process start-up and ramp-up 5) Strong expertise in reliability analysis, failure analysis, and material characterization 6) Excellent verbal and communication skills with 15+ journal and conference publications, and 1 patent filed

Fan Wu’s Current Industry Hp

Fan Wu’s Prior Industry
Georgia Institute Of Technology | Hp

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Work Experience

Hp

Research Development Process Engineer

Sat Sep 01 2018 00:00:00 GMT+0000 (Coordinated Universal Time) — Present

Georgia Institute Of Technology

Graduate Research Assistant

Mon Aug 01 2016 00:00:00 GMT+0000 (Coordinated Universal Time) — Sun Jul 01 2018 00:00:00 GMT+0000 (Coordinated Universal Time)

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Fan Wu Email Addresses

[email protected] Email

Fan Wu Phone Number

No phone number available. Phone number

FAQ About Fan Wu

Fan Wu is located at
Corvallis, Oregon, United States

Fan Wu is a
1) Process development engineer with 5 years’ leadership in wirebond, dispense and EMC molding process focusing on process innovation and quality control 2) 7 years’ professional experience in electronic packaging and IC packaging material development 3) Extensive experience in MEMS packaging, FMEA, SPC, DOE, module integration, high volume manufacturing, risk management and factory automation 4) Highly accomplished in working with external vendors for tool assessment, material qualification, new process start-up and ramp-up 5) Strong expertise in reliability analysis, failure analysis, and material characterization 6) Excellent verbal and communication skills with 15+ journal and conference publications, and 1 patent filed Hp

Fan Wu currently works in the
Hp

Fan Wu specializes in
1) Process development engineer with 5 years’ leadership in wirebond, dispense and EMC molding process focusing on process innovation and quality control 2) 7 years’ professional experience in electronic packaging and IC packaging material development 3) Extensive experience in MEMS packaging, FMEA, SPC, DOE, module integration, high volume manufacturing, risk management and factory automation 4) Highly accomplished in working with external vendors for tool assessment, material qualification, new process start-up and ramp-up 5) Strong expertise in reliability analysis, failure analysis, and material characterization 6) Excellent verbal and communication skills with 15+ journal and conference publications, and 1 patent filed