Hao-Cheng Hou
7+ years working experience on advanced assembly technology, including wafer level InFO development, 3DIC development, and flip chip... | Taiwan
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Hao-Cheng Hou’s Emails d9****@oz****.nthu
Hao-Cheng Hou’s Phone Numbers No phone number available.
Social Media
Hao-Cheng Hou’s Location Taiwan
Hao-Cheng Hou’s Expertise 7+ years working experience on advanced assembly technology, including wafer level InFO development, 3DIC development, and flip chip with coreless substrate. 7+ years research experience on magnetic recording media and MRAM during PhD program. 10 US patent issued (http://www.patentbuddy.com/Inventor/Hou-Hao-Cheng/12948226?) Specialties: Integrated Fan-Out (InFO) and 3DIC technology Flip chip process and assembly flow development Magnetic Recording Thin Films Characterization of material microstructure High density magnetic recording media Magnetic properties measurement X-ray magnetic circular dichroism & X-ray absorption spectra Polarized neutron reflectometry
Hao-Cheng Hou’s Current Industry 台灣積體電路製造股份有限公司
Hao-Cheng
Hou’s Prior Industry
Tsmc
|
National Tsing Hua University
|
台灣積體電路製造股份有限公司
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Work Experience
台灣積體電路製造股份有限公司
Technical Manager
Wed Jul 01 2020 00:00:00 GMT+0000 (Coordinated Universal Time) — Present
Tsmc
Principal Engineer
Wed Aug 01 2012 00:00:00 GMT+0000 (Coordinated Universal Time) — Wed Jul 01 2020 00:00:00 GMT+0000 (Coordinated Universal Time)
National Tsing Hua University
Ph.D Candidate
Mon Aug 01 2005 00:00:00 GMT+0000 (Coordinated Universal Time) — Thu Mar 01 2012 00:00:00 GMT+0000 (Coordinated Universal Time)
Tsmc
Technical Manager
— PresentSkills
Languages
Hao-Cheng Hou Email Addresses
FAQ About Hao-Cheng Hou
-
Hao-Cheng Hou is located at
Taiwan -
Hao-Cheng Hou is a
7+ years working experience on advanced assembly technology, including wafer level InFO development, 3DIC development, and flip chip with coreless substrate. 7+ years research experience on magnetic recording media and MRAM during PhD program. 10 US patent issued (http://www.patentbuddy.com/Inventor/Hou-Hao-Cheng/12948226?) Specialties: Integrated Fan-Out (InFO) and 3DIC technology Flip chip process and assembly flow development Magnetic Recording Thin Films Characterization of material microstructure High density magnetic recording media Magnetic properties measurement X-ray magnetic circular dichroism & X-ray absorption spectra Polarized neutron reflectometry 台灣積體電路製造股份有限公司 -
Hao-Cheng Hou currently works in the
台灣積體電路製造股份有限公司 -
Hao-Cheng Hou specializes in
7+ years working experience on advanced assembly technology, including wafer level InFO development, 3DIC development, and flip chip with coreless substrate. 7+ years research experience on magnetic recording media and MRAM during PhD program. 10 US patent issued (http://www.patentbuddy.com/Inventor/Hou-Hao-Cheng/12948226?) Specialties: Integrated Fan-Out (InFO) and 3DIC technology Flip chip process and assembly flow development Magnetic Recording Thin Films Characterization of material microstructure High density magnetic recording media Magnetic properties measurement X-ray magnetic circular dichroism & X-ray absorption spectra Polarized neutron reflectometry -
Hao-Cheng Hou speaks the following languages:
No languages available. -
Hao-Cheng Hou has prior experience in the following industries:
Tsmc , National Tsing Hua University -
Hao-Cheng Hou has the following professional experience:
台灣積體電路製造股份有限公司 , Tsmc , National Tsing Hua University , Tsmc . -
You can view Hao-Cheng Hou’s
LinkedIn profile at LinkedIn URL. -
Hao-Cheng Hou’s work email addresses are
[email protected] . -
Hao-Cheng Hou works at
台灣積體電路製造股份有限公司
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