
Ibrahim Misbah
Currently, working as Packaging R&D Engineer at Intel Corporation. The work primarily focuses on wafer level assembly. | Hillsboro, Oregon, United States
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Ibrahim Misbah’s Emails ib****@in****.com
Ibrahim Misbah’s Phone Numbers No phone number available.
Social Media
Ibrahim Misbah’s Location Hillsboro, Oregon, United States
Ibrahim Misbah’s Expertise Currently, working as Packaging R&D Engineer at Intel Corporation. The work primarily focuses on wafer level assembly.
Ibrahim Misbah’s Current Industry Intel
Ibrahim
Misbah’s Prior Industry
Project Tukitaki
|
Ieee Communications Society
|
University Of Houston
|
Intel
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Work Experience

Intel
Packaging Research & Development Engineer
Fri Oct 01 2021 00:00:00 GMT+0000 (Coordinated Universal Time) — Present
University Of Houston
Graduate Research Assistant
Mon Aug 01 2016 00:00:00 GMT+0000 (Coordinated Universal Time) — Tue Dec 01 2020 00:00:00 GMT+0000 (Coordinated Universal Time)
Project Tukitaki
Database Administrator
Tue Jan 01 2013 00:00:00 GMT+0000 (Coordinated Universal Time) — Sat Mar 01 2014 00:00:00 GMT+0000 (Coordinated Universal Time)
Ieee Communications Society
Student Member
Tue Jan 01 2013 00:00:00 GMT+0000 (Coordinated Universal Time) — Sun Dec 01 2013 00:00:00 GMT+0000 (Coordinated Universal Time)