Lip Lai
1) 6 years working in manufacturing as product/NPI engineer, responsible for product transfer, new product introduction yield improvement,... | Malaysia
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Lip Lai’s Emails li****@ag****.com
Lip Lai’s Phone Numbers No phone number available.
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Lip Lai’s Location Malaysia
Lip Lai’s Expertise 1) 6 years working in manufacturing as product/NPI engineer, responsible for product transfer, new product introduction yield improvement, process improvement, test setup, design for cost saving. 2) 5 years working as Design engineer for rf/u-wave, mmwave module design and low noise PCB design. Experience in designing RF IC test board. 3) ~ 1 year PI/SI IC packaging. Specialties: RF/u-wave design and development.
Lip Lai’s Current Industry Agilent Technologies
Lip
Lai’s Prior Industry
Agilent Technologies
|
Altera
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Work Experience
Agilent Technologies
Engineering Manager
Mon Aug 01 2011 00:00:00 GMT+0000 (Coordinated Universal Time) — Present
Altera
Packaging Engineer
Mon Nov 01 2010 00:00:00 GMT+0000 (Coordinated Universal Time) — Mon Aug 01 2011 00:00:00 GMT+0000 (Coordinated Universal Time)
Agilent Technologies
R&D Engineer
Mon May 01 2006 00:00:00 GMT+0000 (Coordinated Universal Time) — Mon Nov 01 2010 00:00:00 GMT+0000 (Coordinated Universal Time)
Agilent Technologies
Product/Npi/Design Engineer
Sat Jan 01 2000 00:00:00 GMT+0000 (Coordinated Universal Time) — Mon May 01 2006 00:00:00 GMT+0000 (Coordinated Universal Time)Skills
Languages
Lip Lai Email Addresses
FAQ About Lip Lai
-
Lip Lai is located at
Malaysia -
Lip Lai is a
1) 6 years working in manufacturing as product/NPI engineer, responsible for product transfer, new product introduction yield improvement, process improvement, test setup, design for cost saving. 2) 5 years working as Design engineer for rf/u-wave, mmwave module design and low noise PCB design. Experience in designing RF IC test board. 3) ~ 1 year PI/SI IC packaging. Specialties: RF/u-wave design and development. Agilent Technologies -
Lip Lai currently works in the
Agilent Technologies -
Lip Lai specializes in
1) 6 years working in manufacturing as product/NPI engineer, responsible for product transfer, new product introduction yield improvement, process improvement, test setup, design for cost saving. 2) 5 years working as Design engineer for rf/u-wave, mmwave module design and low noise PCB design. Experience in designing RF IC test board. 3) ~ 1 year PI/SI IC packaging. Specialties: RF/u-wave design and development. -
Lip Lai speaks the following languages:
No languages available. -
Lip Lai has prior experience in the following industries:
Altera , Agilent Technologies , Agilent Technologies -
Lip Lai has the following professional experience:
Agilent Technologies , Altera , Agilent Technologies , Agilent Technologies . -
You can view Lip Lai’s
LinkedIn profile at LinkedIn URL. -
Lip Lai’s work email addresses are
[email protected] . -
Lip Lai works at
Agilent Technologies
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