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Paul Chang

Experienced engineer with proven technical leadership in the semiconductor industry. Adept in all aspects of physical design, including... | Tempe, Arizona, United States

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Paul Chang’s Location Tempe, Arizona, United States

Paul Chang’s Expertise Experienced engineer with proven technical leadership in the semiconductor industry. Adept in all aspects of physical design, including floor planning, logic synthesis, auto place and route, static timing, formal verification, and design for test. Skilled in collaborating with system architects and package design teams to deliver optimized solutions. Proficient in ASIC development, low-power design, and advanced 3DIC technologies, with a strong track record of driving innovative solutions and optimizing complex designs.

Paul Chang’s Current Industry Intel

Paul Chang’s Prior Industry
Intel

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Work Experience

Intel

3DIC Physical Design Engineer

Tue Feb 01 2022 00:00:00 GMT+0000 (Coordinated Universal Time) — Present

Intel

Senior Physical Design Engineer

Mon Jan 01 2001 00:00:00 GMT+0000 (Coordinated Universal Time) — Sat Jan 01 2022 00:00:00 GMT+0000 (Coordinated Universal Time)

Intel

Component Design Engineer

Sat Jun 01 1996 00:00:00 GMT+0000 (Coordinated Universal Time) — Mon Jan 01 2001 00:00:00 GMT+0000 (Coordinated Universal Time)

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FAQ About Paul Chang

Paul Chang is located at
Tempe, Arizona, United States

Paul Chang is a
Experienced engineer with proven technical leadership in the semiconductor industry. Adept in all aspects of physical design, including floor planning, logic synthesis, auto place and route, static timing, formal verification, and design for test. Skilled in collaborating with system architects and package design teams to deliver optimized solutions. Proficient in ASIC development, low-power design, and advanced 3DIC technologies, with a strong track record of driving innovative solutions and optimizing complex designs. Intel

Paul Chang currently works in the
Intel

Paul Chang specializes in
Experienced engineer with proven technical leadership in the semiconductor industry. Adept in all aspects of physical design, including floor planning, logic synthesis, auto place and route, static timing, formal verification, and design for test. Skilled in collaborating with system architects and package design teams to deliver optimized solutions. Proficient in ASIC development, low-power design, and advanced 3DIC technologies, with a strong track record of driving innovative solutions and optimizing complex designs.